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Gas Abatement

Wherever possible, use of Perfluorocarbon (PFC) gases like CF4 and C2F6 has been restricted due to their high global warming potential, as much as 50,000 times worse than carbon dioxide. Where no better alternative exists, and their use is unavoidable, the gases must be broken down into less harmful by-products before being released.

One example is the use of PFC gases in semiconductor etch and chamber-cleaning processes. As an alternative to thermally breaking down the exhaust gases from these processes, atmospheric plasma can be used, having the advantage of being a cleaner technology, and not needing special fuels to run.

Adtec equipment supporting this application is the VAW plasma.